Archived posting to the Leica Users Group, 2000/09/11
[Author Prev] [Author Next] [Thread Prev] [Thread Next] [Author Index] [Topic Index] [Home] [Search]From an article in today's New York Times (and for copyright reasons, I'll just quote parts): >>>>>>>>>> Only two weeks ago, Eastman Kodak announced a chip able to capture digital images with a resolution of 4,096 by 4,096 picture elements - -- or pixels -- per square inch. That, by some measures, is about twice the resolution of 35-millimeter film. Today, a company founded by one of Silicon Valley's pioneer chip designers, will announce an image-sensing chip capable of the same resolution as the Kodak chip, but made using a technique that could be much less expensive. Executives of the company, Foveon, said they had given a prototype camera based on their chip to a photographer in Los Angeles, Greg Gorman, who had used it to make a portrait of a cowboy. In that image, no pixels, or dots, were visible to the eye, even with the photograph blown up to a size of 8 feet by 4 feet. .......... Both companies' achievements have startled industry experts because the new devices move far beyond the current industry standards for CMOS and for C.C.D. cameras, which until now have been able to achieve resolutions of 6 million pixels a square inch. The Foveon and Kodak sensors can pack 16.8 million pixels into a square inch. "If you asked someone if this was achievable in either technology two weeks ago, they would have said it was impossible," said Michael Berger, an industry analyst at Frost & Sullivan, a market research firm in San Antonio. .......... Foveon's contribution has been to improve the quality of CMOS images by continuing to put more computer processing power behind the task of capturing the digital image. The new 16.8 million pixel device has seven active transistors for each pixel. The benefits include less interference, better focusing and more precise exposure times. "When the pixels get smarter," Mr. Mead said, "that translates into better image quality." Foveon's principal investor and the company's technology partner is National Semiconductor, a big Silicon Valley chip maker. National Semiconductor's manufacturing plant in Santa Clara is capable of etching chip circuitry only 0.18 micron wide -- a microscopic fineness that few other chip makers can equal. By contrast, most current low-cost CMOS sensors are made with circuitry of 0.35 or 0.5 microns, which allows for millions fewer transistors per chip. National Semiconductor executives said the company was planning to take the technology that Foveon had developed for the priciest reaches of the professional photography market and make it economical enough for some new consumer electronics. "National's interest is not in thousands of cameras a year but in hundreds of millions of cameras a year," said Brian L. Halla, the company's president and chief executive. "We could make the world's highest-resolution throwaway digital camera and sell it for the price of a similar Kodak system." Foveon officials said they would demonstrate the new 16.8 million pixel sensor for the first time today. The sensor, which for now captures images in black and white, has almost 70 million transistors - -- or about two and a half times the number of transistors used by a Pentium III microprocessor chip for computers. Foveon says it expects the new sensor to be on the market within a year. <<<<<<<<<< The full article can be found online at http://www.nytimes.com/2000/09/11/technology/11CHIP.html (but you may need to register with the NY Times site first to access it).