Archived posting to the
Leica Users Group, 2002/02/11
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Subject: Re: [Leica] RE: Foveon Chip
From: "Joseph Codispoti" <joecodi@clearsightusa.com>
Date: Mon, 11 Feb 2002 11:48:12 -0800
References: <EC1D893EF5042348ADC8A79B742E9EFB6D89DB@GCI-MOCEX01.us.ad.gannett.com> <5.1.0.14.2.20020211100851.03af23b0@pop.alink.net> <3C681580.4090708@istate.net>
From: "Bill Satterfield" <cwsat@istate.net>
To: <leica-users@mejac.palo-alto.ca.us>
> I wonder how it compares to the Buffalo chip?
It is a silicon wafer rather than a "meadow wafer"
Joe
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In reply to:
Message from "Zeissler, Mitch" <mzeissle@gcipoa.gannett.com> (RE: [Leica] Foveon Chip)
Message from Jim Brick <jim@brick.org> ([Leica] RE: Foveon Chip)
Message from Bill Satterfield <cwsat@istate.net> (Re: [Leica] RE: Foveon Chip)